Sensor having thermal gradients

ABSTRACT

This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority under 35 U.S.C. §119(e) to U.S. Prov.App. No. 61/878,666, entitled “SENSOR FOR USE WITH THERMAL GRADIENTS,”filed Sep. 17, 2013, which is hereby incorporated by reference as iffully set forth herein.

TECHNICAL FIELD

This disclosure generally relates to sensors and more particularly to asensor having thermal gradients.

BACKGROUND

The measurement of differential pressure is important in manyapplications such as those measuring oil pressures, fuel pressure,hydraulic pressure, air pressure, and the like. In many of theseapplications, it may not be desirable to measure differential pressureby applying different pressures to opposite sides of a sensor'sdiaphragm. Instead, a half-bridge sensor configuration may be used, suchas described in U.S. Pat. No. 4,695,817, entitled “ENVIRONMENTALLYPROTECTED PRESSURE TRANSDUCERS EMPLOYING TWO ELECTRICALLY INTERCONNECTEDTRANSDUCER ARRAYS,” issued Sep. 22, 1987 to Dr. Anthony D. Kurtz et al,and assigned to Kulite Semiconductor Products, Inc., the assigneeherein. This configuration has many benefits but may be susceptible totemperature differences, since each side of the differential sensor maybe physically located in different environments. In some applications, ahot liquid such as engine oil may be applied to the front-side of thesensor's diaphragm, while a cool gas such as atmospheric air may beapplied to the back-side of the sensor's diaphragm. In this case,compensating for the temperature difference between each side of thesensor's diaphragm may be difficult. Typical temperature compensation ofhalf-bridge sensors assume that both sensors are at the sametemperature, so that any temperature effects may be compensated usingtemperature compensation techniques such as described in U.S. Pat. No.3,245,252, entitled “TEMPERATURE COMPENSATED SEMICONDUCTOR STRAIN GAGEUNIT” issued Apr. 12, 1966 to Dr. Anthony Kurtz et al., and assigned toKulite Semiconductor Products, Inc., the assignee herein.

FIG. 1 illustrates a prior art sensor assembly 100. The prior art sensorassembly 100 includes a first transducer 101, a first header 102, ahousing 103, a second transducer 104, a second header 105, a shell 106,and a main port 107. In FIG. 1, the first transducer 101 forms a firsthalf of a Wheatstone bridge and the second transducer 104 forms a secondhalf of the Wheatstone bridge. The first transducer 101 is disposedwithin the first header 102, which is directly connected to the housing103. Pressure at the main port 107 is applied to a front-side of thefirst transducer 101. The second transducer 104 is disposed within thesecond header 105, which is connected to the prior art sensor assembly100 using the shell 106. The shell 106 may not transfer heatefficiently, so any uneven temperatures applied at the main port 107 ofthe sensor assembly 100 may cause a large thermal gradient across thebody of the sensor assembly 100. The sensor assembly 100 may use thefirst transducer 101 to measure a first difference between a mainpressure at the main port 107 and a third pressure such as atmosphericpressure. The sensor assembly 100 may use the second transducer 104 tomeasure a second difference between a reference pressure and the thirdpressure such as atmospheric pressure.

SUMMARY OF THE DISCLOSURE

Briefly described, embodiments of the present invention relate to asensor having thermal gradients. In one embodiment, a sensor assemblymay be configured to include a first header and a second header, ahousing, and a first transducer and a second transducer. The housing maybe coupled to the first header and the second header. Further, the firsttransducer may be coupled to the first header. The first transducer maybe configured to receive a first pressure, measure the first pressureand output a first pressure signal associated with the first pressure.Similarly, the second transducer may be configured to receive a secondpressure, measure the second pressure and output a second pressuresignal associated with the second pressure. Finally, the firsttransducer and the second transducer may be positioned in the housingsuch that a first temperature of the first transducer is aboutequivalent to a second temperature of the second transducer duringoperation of the sensor assembly.

BRIEF DESCRIPTION OF THE FIGURES

The present disclosure is illustrated by way of examples, embodimentsand the like and is not limited by the accompanying figures, in whichlike reference numbers indicate similar elements. Elements in thefigures are illustrated for simplicity and clarity and have notnecessarily been drawn to scale. The figures along with the detaileddescription are incorporated and form part of the specification andserve to further illustrate examples, embodiments and the like, andexplain various principles and advantages, in accordance with thepresent disclosure, where:

FIG. 1 illustrates a prior art sensor assembly.

FIG. 2 shows a longitudinal cross-sectional view of one embodiment of asensor assembly having thermal gradients in accordance with variousaspects set forth herein.

FIG. 3 shows a partial longitudinal cross-sectional view of anotherembodiment of a sensor assembly having thermal gradients in accordancewith various aspects set forth herein.

FIG. 4 shows a top view of another embodiment of a sensor assemblyhaving thermal gradients in accordance with various aspects set forthherein.

DETAILED DESCRIPTION

The following detailed description is merely illustrative in nature andis not intended to limit the present disclosure, or the application anduses of the present disclosure. Furthermore, there is no intention to bebound by any expressed or implied theory presented in the precedingfield of use, background, or summary of the disclosure or the followingdetailed description. The present disclosure provides various examples,embodiments and the like, which may be described herein in terms offunctional or logical block elements. Various techniques describedherein may be used for a sensor having thermal gradients. The variousaspects described herein are presented as methods, devices (orapparatus), and systems that may include a number of components,elements, members, modules, nodes, peripherals, or the like. Further,these methods, devices, and systems may include or not includeadditional components, elements, members, modules, nodes, peripherals,or the like.

Throughout the specification and the claims, the following terms take atleast the meanings explicitly associated herein, unless the contextclearly dictates otherwise. The terms “connect,” “connecting,” and“connected” mean that one function, feature, structure, orcharacteristic is directly joined to or in communication with anotherfunction, feature, structure, or characteristic. The terms “couple,”“coupling,” and “coupled” mean that one function, feature, structure, orcharacteristic is directly or indirectly joined to or in communicationwith another function, feature, structure, or characteristic. Relationalterms such as “first” and “second,” and the like may be used solely todistinguish one entity or action from another entity or action withoutnecessarily requiring or implying any actual such relationship or orderbetween such entities or actions. The term “or” is intended to mean aninclusive or. Further, the terms “a,” “an,” and “the” are intended tomean one or more unless specified otherwise or clear from the context tobe directed to a singular form. The term “include” and its various formsare intended to mean including but not limited to. The terms“substantially,” “essentially,” “approximately,” “about” or any otherversion thereof, are defined as being close to as understood by one ofordinary skill in the art, and in one non-limiting embodiment the termis defined to be within 10%, in another embodiment within 5%, in anotherembodiment within 1% and in another embodiment within 0.5%.

In the following description, numerous specific details are set forth.However, it is to be understood that embodiments of the disclosedtechnology may be practiced without these specific details. Referencesto “one embodiment,” “an embodiment,” “example embodiment,” “variousembodiments,” and other like terms indicate that the embodiments of thedisclosed technology so described may include a particular function,feature, structure, or characteristic, but not every embodimentnecessarily includes the particular function, feature, structure, orcharacteristic. Further, repeated use of the phrase “in one embodiment”does not necessarily refer to the same embodiment, although it may.

This disclosure presents a sensor having thermal gradients. Forinstance, by configuring a sensor in accordance with various aspectsdescribed herein, an improved pressure measurement capability of asensor having a thermal gradient is provided. For example, FIG. 2 showsa longitudinal cross-sectional view of one embodiment of a sensorassembly 200 having thermal gradients in accordance with various aspectsset forth herein. In FIG. 2, the sensor assembly 200 may be configuredto include a first transducer 201, a first header 202, a secondtransducer 204, a second header 205, a shell 206, a first port 207, asecond port 208 and a housing 211. The first transducer 201 may form afirst half of a piezoresistive network and the second transducer 204 mayform a second half of the piezoresistive network. In one example, apiezoresistive network may be a Wheatstone bridge. A half of apiezoresistive network may also be referred to as a half-bridgetransducer or half of a Wheatstone bridge. The sensor assembly 200 mayuse the first transducer 201 to measure a first pressure from the firstport 207. The sensor assembly 200 may use the second transducer 204 tomeasure a second pressure from the second port 208. In one example, thefirst pressure may be a main pressure and the second pressure may be areference pressure, which may be used to determine a differentialpressure signal. In another example, the first pressure may be a firstmain pressure and the second pressure may be a second main pressure. Inanother example, the first pressure may be a main pressure and thesecond pressure may be atmospheric pressure. The first pressure signaland the second pressure signal may be provided by the sensor assembly200 to a remote device.

In FIG. 2, the sensor assembly 200 may be configured to include thehousing 211 at a front portion of the sensor assembly 200. The housing211 may be used to attach or secure the sensor assembly 200 to anotherstructure, protect all or a portion of the sensor assembly 200, providea means to handle or place the sensor assembly 200, or another similarcharacteristic. The housing 211 may be used to form an O-ring seal, maybe threaded, may include a series of O-rings or bolts, or the like sothat the sensor assembly 200 may be attached to another structure. Inone example, the housing 211 may be made of a thermally conductivematerial such as metal. The first transducer 201 may be disposed on,near or within the first header 202. For example, the first transducer201 may be secured, bonded, welded, press fit or the like to the firstheader 202. Similarly, the second transducer 204 may be disposed on,near or within the second header 205. For example, the second transducer204 may be secured, bonded, welded, press fit or the like to the secondheader 205. The housing 211 may be disposed around and define the firstport 207 and the second port 208. The first port 207 may allow the firstpressure to enter the housing 211 for measurement by the firsttransducer 201. The second port 208 may allow the second pressure toenter the housing 211 for measurement by the second transducer 204. Thefirst header 202 and the second header 205 may be disposed on, near orwithin the housing 211. For example, the first header 202 and the secondheader 205 may be secured, bonded, welded, press fit or the like to thehousing 211.

Furthermore, since the first header 202 and the second header 205 arephysically proximate and coupled to the housing 211, the housing 211 maybe used to temperature regulate the first transducer 201 and the secondtransducer 204, resulting in the first transducer 201 and the secondtransducer 204 having about equivalent temperatures during operation ofthe sensor assembly 200. For instance, the first transducer 201 and thesecond transducer 204 may have temperatures within about two degreesCelsius (±2° C.), about five degrees Celsius (±5° C.), about ten degreesCelsius (±10° C.), or the like during operation of the sensor assembly200. The first transducer 201 and the second transducer 204 may be aboutlaterally equidistant from a front surface of the housing 211. Further,the first transducer 201 and the second transducer 204 may besymmetrically positioned relative to a longitudinal axis of the sensorassembly 200. In addition to the physical proximity of the firsttransducer 201 and the second transducer 204 to the housing 211, anincreased mass of the housing 211 may also result in the firsttransducer 201 and the second transducer 204 having about equivalenttemperatures during operation of the sensor assembly 200, which mayallow for the use of standard passive or active temperaturecompensation. Further, it may not be necessary to characterize thesensor assembly 200 using a temperature gradient, which may be difficultto perform in a production setting. In one example, the mass of thehousing 211 may be at least a combined mass of the first transducer 201,the first header 202, the second transducer 204 and the second header205. A person having ordinary skill in the art will recognize varioustechniques for performing temperature compensation of sensormeasurements.

In another embodiment, a sensor assembly may include an electroniccomponent such as an electronic circuit, a field programmable gate array(FPGA), a processor, a controller, or the like. The electronic componentmay receive a first pressure signal from a first transducer and a secondpressure signal from a second transducer. The electronic component maydetermine a differential pressure signal using the first pressure signaland the second pressure signal.

In another embodiment, each of a first header and a second header may betilted relative to a longitudinal axis of a sensor assembly. In oneexample, each of the first header and the second header may be disposedabout parallel, about thirty degrees (30°), about forty-five degrees(45°), about sixty degrees (60°), about perpendicular or the likerelative to the longitudinal axis of the sensor assembly.

FIG. 3 shows a partial longitudinal cross-sectional view of anotherembodiment of a sensor assembly 300 having thermal gradients inaccordance with various aspects set forth herein. In FIG. 3, the sensorassembly 300 may be configured to include a first transducer, a secondtransducer, a third transducer 315 a, a fourth transducer 315 b, a firstheader, a second header, a third header 316, a first port, a secondport, a third port 313, and a housing 311. In one example, the firsttransducer may form a first half of a first piezoresistive network andthe third transducer 315 a may form a second half of the firstpiezoresistive network. Further, the second transducer may form a firsthalf of a second piezoresistive network and the fourth transducer 315 bmay form a second half of the second piezoresistive network. The firsttransducer may be disposed on, near or within the first header. Forexample, the first transducer may be secured, bonded, welded, press fitor the like to the first header. The second transducer may be disposedon, near or within the second header. For example, the second transducermay be secured, bonded, welded, press fit or the like to the secondheader. The third transducer 315 a and the fourth transducer 315 b maybe disposed on, near or within the third header 316. For example, thethird transducer 315 a and the fourth transducer 315 b may be secured,bonded, welded, press fit or the like to the third header 316. Thehousing 311 may be disposed around and form the first port, the secondport, and the third port 313. The first port may allow the firstpressure to enter the housing 311 for measurement by the firsttransducer. The second port may allow the second pressure to enter thehousing 311 for measurement by the second transducer. The third port 313may allow the third pressure to enter the third header 316 formeasurement by the third transducer 315 a or the fourth transducer 315b.

Furthermore, since the first header, the second header and the thirdheader 316 are physically proximate and coupled to the housing 311, thehousing 311 may be used to temperature regulate the first transducer,the second transducer, the third transducer 315 a and the fourthtransducer 315 b, resulting in the first transducer, the secondtransducer, the third transducer 315 a and the fourth transducer 315 bhaving about equivalent temperatures during operation of the sensorassembly 300. For instance, the first transducer, the second transducer,the third transducer 315 a and the fourth transducer 315 b may havetemperatures within about two degrees Celsius (±2° C.), about fivedegrees Celsius (±5° C.), about ten degrees Celsius (±10° C.), or thelike during operation of the sensor assembly 300. The first transducer,the second transducer, the third transducer 315 a and the fourthtransducer 315 b may be about laterally equidistant from a front surfaceof the housing 311. Further, the first transducer, the secondtransducer, the third transducer 315 a and the fourth transducer 315 bmay be symmetrically positioned relative to a longitudinal axis of thesensor assembly 200. In addition to the physical proximity of the firstheader, the second header and the third header 316 to the housing 311,an increased mass of the housing 311 may also result in the firsttransducer, the second transducer, the third transducer 315 a and thefourth transducer 315 b having about equivalent temperatures duringoperation of the sensor assembly 300, which may allow use of standardpassive or active temperature compensation. In one example, a mass ofthe housing 311 may be at least a mass of the first header, the secondheader and the third header 316 and the first transducer, the secondtransducer, the third transducer 315 a and the fourth transducer 315 b.

In FIG. 3, the first transducer may receive from the first port andmeasure the first pressure to generate a first pressure signal. Thesecond transducer may receive from the second port and measure thesecond pressure to generate a second pressure signal. Also, the thirdtransducer 315 a and the fourth transducer 315 b may receive from thethird port and measure the third pressure and the fourth pressure togenerate a third pressure signal and a fourth pressure signal,respectively. A first differential pressure signal may be generated bydetermining a first difference between the first pressure signal and thethird pressure signal. Similarly, a second differential pressure signalmay be generated by determining a second difference between the secondpressure signal and the fourth pressure signal. The first differentialpressure signal and the second differential pressure signal may be usedto compensate for any thermal gradients in the sensor assembly 300. Inone example, the first pressure may be a first main pressure, the secondpressure may be a second main pressure and the third pressure may be areference pressure, which may be used to determine a differentialpressure signal. In another example, the first pressure and the secondpressure may be the same pressure. The first pressure signal, the secondpressure signal, the third pressure signal and the fourth pressuresignal may be provided by the sensor assembly 300 to a remote device.

In another embodiment, a sensor assembly may include an electroniccomponent such as an electronic circuit, a field programmable gate array(FPGA), a processor, a controller, or the like. The electronic componentmay receive a first pressure signal from a first transducer, a secondpressure signal from a second transducer, a third pressure signal from athird transducer and a fourth pressure signal from a fourth transducer.In one example, the first pressure signal may be associated with a firstmain pressure, the second pressure signal may be associated with asecond main pressure, and the third pressure signal and the fourthpressure signal may be associated with a reference pressure. Theelectronic component may determine a first differential pressure signalby determining a difference between the first pressure signal and thethird pressure signal. Similarly, the electronic component may determinea second differential pressure signal by determining a differencebetween the second pressure signal and the fourth pressure signal. Theelectronic component may provide the first differential pressure signaland the second differential pressure signal to the remote device.

In another embodiment, each of a first header, a second header and athird header may be tilted relative to a longitudinal axis of a sensorassembly. In one example, each of the first header, the second headerand the third header may be disposed about parallel, about thirtydegrees (30°), about forty-five degrees (45°), about sixty degrees(60°), about perpendicular or the like relative to the longitudinal axisof the sensor assembly.

In another embodiment, a sensor assembly may be configured to include afirst transducer, a second transducer, a third transducer, a fourthtransducer, a first header, a second header, a third header, a fourthheader, a first port, a second port, a third port, a fourth port and ahousing. In one example, the first transducer may form a first half of afirst piezoresistive network and the third transducer may form a secondhalf of the first piezoresistive network. Further, the second transducermay form a first half of a second piezoresistive network and the fourthtransducer may form a second half of the second piezoresistive network.The first transducer may be disposed on, near or within the firstheader. For example, the first transducer may be secured, bonded,welded, press fit or the like to the first header. The second transducermay be disposed on, near or within the second header. For example, thesecond transducer may be secured, bonded, welded, press fit or the liketo the second header. The third transducer may be disposed on, near orwithin the third header. For example, the third transducer may besecured, bonded, welded, press fit or the like to the third header. Thefourth transducer may be disposed on, near or within the third header.For example, the fourth transducer may be secured, bonded, welded, pressfit or the like to the third header. The housing may be disposed aroundand form the first port, the second port, the third port and the fourthport. The first port may allow the first pressure to enter the housingfor measurement by the first transducer. The second port may allow thesecond pressure to enter the housing for measurement by the secondtransducer. The third port may allow the third pressure to enter thethird header for measurement by the third transducer. The fourth portmay allow the fourth pressure to enter the fourth header for measurementby the fourth transducer.

Furthermore, since the first header, the second header, the third headerand the fourth header are physically proximate and coupled to thehousing, the housing may be used to temperature regulate the firsttransducer, the second transducer, the third transducer and the fourthtransducer, resulting in the first transducer, the second transducer,the third transducer and the fourth transducer having about equivalenttemperatures including during operation of the sensor assembly. Forinstance, the first transducer, the second transducer, the thirdtransducer and the fourth transducer may have temperatures within abouttwo degrees Celsius (±2° C.), about five degrees Celsius (±5° C.), aboutten degrees Celsius (±10° C.), or the like including during operation ofthe sensor assembly. The first transducer, the second transducer, thethird transducer and the fourth transducer may be about laterallyequidistant from a front surface of the housing. Further, the firsttransducer, the second transducer, the third transducer and the fourthtransducer may be symmetrically positioned relative to a longitudinalaxis of the sensor assembly. In addition to the physical proximity ofthe first header, the second header, the third header and the fourthheader to the housing, an increased mass of the housing may also resultin the first transducer, the second transducer, the third transducer andthe fourth transducer having about equivalent temperatures duringoperation of the sensor assembly, which may allow use of standardpassive or active temperature compensation. In one example, a mass ofthe housing may be at least a mass of the first header, the secondheader, the third header and the fourth header, as well as the firsttransducer, the second transducer, the third transducer and the fourthtransducer.

In the current embodiment, the first transducer may receive from thefirst port and measure the first pressure to generate a first pressuresignal. Further, the second transducer may receive from the second portand measure the second pressure to generate a second pressure signal.The third transducer may receive from the third port and measure thethird pressure to generate a third pressure signal. Also, the fourthtransducer may receive from the fourth port and measure the fourthpressure to generate a fourth pressure signal. A first differentialpressure signal may be generated by determining a first differencebetween the first pressure signal and the third pressure signal.Similarly, a second differential pressure signal may be generated bydetermining a second difference between the second pressure signal andthe fourth pressure signal. The first differential pressure signal andthe second differential pressure signal may be used to compensate forany thermal gradients in the sensor assembly. In one example, the firstpressure may be a first main pressure, the second pressure may be asecond main pressure, the third pressure may be a first referencepressure, and the fourth pressure may be a second referenced pressure.The first reference pressure and the second reference pressure may beatmospheric pressure. The first pressure signal, the second pressuresignal, the third pressure signal and the fourth pressure signal may beprovided by the sensor assembly to a remote device.

In another embodiment, each of a first header, a second header, a thirdheader and a fourth header may be tilted relative to a longitudinal axisof the sensor assembly. In one example, each of the first header, thesecond header, the third header and the fourth header may be disposedabout parallel, about thirty degrees (30°), about forty-five degrees(45°), about sixty degrees (60°), about perpendicular or the likerelative to the longitudinal axis of the sensor assembly.

In another embodiment, a third header and a fourth header may be thesame header.

In another embodiment, a third port and a fourth port may be the sameport.

In another embodiment, a third transducer and a fourth transducer may bethe same transducer.

FIG. 4 shows a top view of another embodiment of a sensor assembly 400having thermal gradients in accordance with various aspects set forthherein. In FIG. 4, the sensor assembly 400 may be configured to includea first transducer, a second transducer, a third transducer, a fourthtransducer, a first header, a second header, a third header, a firstport 407, a second port 408, a third port 413, and a housing 411. Thefirst header may be disposed within a first sector 421 of the sensorassembly 400, the second header may be disposed within a second sector422 of the sensor assembly 400, and the third header may be disposedwithin a third sector 423 of the sensor assembly 400. Similarly, thefirst transducer may be disposed within the first sector 421 of thesensor assembly 400, the second transducer may be disposed within thesecond sector 422 of the sensor assembly 400, and the third transducerand the fourth transducer may be disposed within the third sector 423 ofthe sensor assembly 400. The first transducer may form a first half of afirst Wheatstone bridge and the third transducer may form a second halfof the first Wheatstone bridge. Similarly, the second transducer mayform a first half of a second Wheatstone bridge and the fourthtransducer may form a second half of the second Wheatstone bridge. Thefirst transducer may be disposed on, near or within the first header,the second transducer may be disposed on, near or within the secondheader, and the third transducer and the fourth transducer may bedisposed on, near or within the third header. The housing 411 may beused to attach or secure the sensor assembly 400 to another structure,protect all or a portion of the sensor assembly 400, provide a means tohandle or place the sensor assembly 400, or another similarcharacteristic. The housing 411 may be used to form an O-ring seal, maybe threaded, may include a series of O-rings or bolts, or the like sothat the sensor assembly 400 may be attached to another structure. Inone example, the housing 411 may be made of a thermally conductivematerial such as metal.

In FIG. 4, the housing 411 may be disposed around and form the firstport 407, the second port 408, and the third port 413. The first port407 may allow the first pressure to enter the housing 411 formeasurement by the first transducer, the second port 408 may allow thesecond pressure to enter the housing 411 for measurement by the secondtransducer, and the third port 413 may allow the third pressure to enterthe housing 411 for measurement by the third transducer and the fourthtransducer. In one example, the first pressure at the first port 407 maybe a first main pressure, the second pressure at the second port 408 maybe a second main pressure, and the third pressure at the third port 413may be an atmospheric pressure. A first differential pressure signal maybe generated by determining a first difference between the firstpressure signal and the third pressure signal. Similarly, a seconddifferential pressure signal may be generated by determining a seconddifference between the second pressure signal and the fourth pressuresignal. The first differential pressure signal and the seconddifferential pressure signal may be used to compensate for any thermalgradients in the sensor assembly 400. The first differential pressuresignal and the second differential pressure signal may be provided bythe sensor assembly 400 to a remote device, wherein the remote devicemay use the first differential pressure signal and the seconddifferential pressure signal to perform temperature compensation ingenerating a temperature-compensated pressure signal.

In another embodiment, a sensor assembly may be configured to include afirst transducer, a second transducer, a third transducer, a fourthtransducer, a first header, a second header, a third header, a fourthheader, a first port, a second port, a third port, a fourth port and ahousing. The first header may be disposed within a first sector of thesensor assembly, the second header may be disposed within a secondsector of the sensor assembly, the third header may be disposed within athird sector of the sensor assembly, and the fourth header may bedisposed within a fourth sector of the sensor assembly. Similarly, thefirst transducer may be disposed within the first sector of the sensorassembly, the second transducer may be disposed within the second sectorof the sensor assembly, the third transducer may be disposed within thethird sector of the sensor assembly, and the fourth transducer may bedisposed within the fourth sector of the sensor assembly. The firsttransducer may form a first half of a first Wheatstone bridge and thethird transducer may form a second half of the first Wheatstone bridge.Similarly, the second transducer may form a first half of a secondWheatstone bridge and the fourth transducer may form a second half ofthe second Wheatstone bridge. The first transducer may be disposed on,near or within the first header, the second transducer may be disposedon, near or within the second header, the third transducer may bedisposed on, near or within the third header, and the fourth transducermay be disposed on, near or within the fourth header. The housing may beused to attach or secure the sensor assembly to another structure,protect all or a portion of the sensor assembly, provide a means tohandle or place the sensor assembly, or another similar characteristic.The housing may be used to form an O-ring seal, may be threaded, mayinclude a series of O-rings or bolts, or the like so that the sensorassembly may be attached to another structure. In one example, thehousing may be made of a thermally conductive material such as metal.

Furthermore, the housing may be disposed around and form the first port,the second port, the third port and the fourth port. The first port mayallow the first pressure to enter the housing for measurement by thefirst transducer, the second port may allow the second pressure to enterthe housing for measurement by the second transducer, the third port mayallow the third pressure to enter the housing for measurement by thethird transducer, and the fourth port may allow the fourth pressure toenter the housing for measurement by the fourth transducer. In oneexample, the first pressure at the first port may be a first mainpressure, the second pressure at the second port may be a second mainpressure, the third pressure at the third port may be a first referencepressure, and the fourth pressure at the fourth port may be a secondreference pressure. A first differential pressure signal may begenerated by determining a first difference between the first pressuresignal and the third pressure signal. Similarly, a second differentialpressure signal may be generated by determining a second differencebetween the second pressure signal and the fourth pressure signal. Thefirst differential pressure signal and the second differential pressuresignal may be used to compensate for any thermal gradients in the sensorassembly. The first differential pressure signal and the seconddifferential pressure signal may be provided by the sensor to a remotedevice, wherein the remote device may use the first differentialpressure signal and the second differential pressure signal to performtemperature compensation in generating a temperature-compensatedpressure signal.

In another embodiment, a port may be configured to receive a pressurehaving a static pressure component and a dynamic pressure component.Further, the port may filter at least a portion of the dynamic pressurecomponent of the pressure.

In another embodiment, a predetermined resonance frequency of a port maybe used to determine at least one of a length and a cross-sectional areaof the port. A person of ordinary skill in the art will recognizetechniques for determining dimensions of a mechanical filter to achievea predetermined resonance frequency.

In another embodiment, a port may have a shape of a spiral.

It is important to recognize that it is impractical to describe everyconceivable combination of components or methodologies for purposes ofdescribing the claimed subject matter. However, a person having ordinaryskill in the art will recognize that many further combinations andpermutations of the subject technology are possible. Accordingly, theclaimed subject matter is intended to cover all such alterations,modifications, and variations that are within the spirit and scope ofthe claimed subject matter.

Although the present disclosure describes specific examples,embodiments, and the like, various modifications and changes may be madewithout departing from the scope of the present disclosure as set forthin the claims below. For example, although the example methods, devicesand systems, described herein are in conjunction with a configurationfor the aforementioned sensor having thermal gradients, the skilledartisan will readily recognize that the example methods, devices orsystems may be used in other methods, devices or systems and may beconfigured to correspond to such other example methods, devices orsystems as needed. Further, while at least one example, embodiment, orthe like has been presented in the foregoing detailed description, manyvariations exist. Accordingly, the specification and figures are to beregarded in an illustrative rather than a restrictive sense, and allsuch modifications are intended to be included within the scope of thepresent disclosure. Any benefits, advantages, or solutions to problemsthat are described herein with regard to specific embodiments are notintended to be construed as a critical, required, or essential featureor element of any or all of the claims. Any benefits, advantages, orsolutions to problems that are described herein with regard to specificexamples, embodiments, or the like are not intended to be construed as acritical, required, or essential feature or element of any or all of theclaims.

What is claimed is:
 1. A system, comprising: a sensor assembly,including: a housing; a first header and a second header coupled to thehousing; a first port extending from the first header and through an endportion of the housing, the first port configured for communication witha first pressure, wherein the first pressure is characterized by adynamic pressure having a first temperature; a second port extendingfrom the second header and through a plurality of channels incommunication with a plurality of respective openings distributed arounda side portion of the housing, the second port configured forcommunication with atmospheric pressure, wherein the atmosphericpressure is characterized by a static pressure having a secondtemperature that differs from the first temperature; a first transducerthermally coupled to the first header and in communication with thefirst pressure by the first port, wherein the first transducer isconfigured to measure the first pressure to generate a first pressuresignal; a second transducer thermally coupled to the second header andin communication with the second pressure port, wherein the secondtransducer is configured to measure the atmospheric pressure to generatea second pressure signal; and wherein the housing comprises a one-piecethermally conductive metal material disposed around and forming thefirst port and the second port, and wherein the first transducer and thesecond transducer are positioned in the housing such that a thirdtemperature of the first transducer is about equivalent to a fourthtemperature of the second transducer during operation of the sensorassembly.
 2. The system of claim 1, wherein the first transducer and thesecond transducer are about laterally equidistant from a front surfaceof the housing.
 3. The system of claim 1, wherein the first transducerand the second transducer are symmetrically positioned relative to alongitudinal axis of the sensor assembly.
 4. The system of claim 1,wherein the housing is configured to secure the sensor to anotherstructure.
 5. The system of claim 1, wherein the sensor assembly furtherincludes: a third header coupled to the housing; a third transducercoupled to the third header, wherein the third transducer is configuredto measure a third pressure to generate a third pressure signal; afourth transducer coupled to the third header, wherein the fourthtransducer is configured to measure a fourth pressure to determine afourth pressure signal; and wherein each of the first transducer, thesecond transducer, the third transducer and the fourth transducer hasabout an equivalent temperature.
 6. The system of claim 5, wherein thesensor assembly further includes: a third port coupled to the thirdtransducer, wherein the housing is disposed around and defines the thirdport; a fourth port coupled to the second transducer, wherein thehousing is disposed around and defines the fourth port; wherein thethird transducer is further configured to: receive, from the third port,a third pressure; and wherein the fourth transducer is furtherconfigured to: receive, from the fourth port, a fourth pressure.
 7. Thesystem of claim 6, wherein the third port and the fourth port are thesame port.
 8. The system of claim 1, wherein the sensor assembly furtherincludes: an electronic component operationally coupled to the firsttransducer and the second transducer, wherein the electronic componentis configured to: receive, from the first transducer, the first pressuresignal; receive, from the second transducer, the second pressure signal;and determine a first differential pressure signal using the firstpressure signal and the second pressure signal.